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Yesterday β€” 6 January 2025Main stream

AMD unveils new chips for laptops, desktops, and gaming handhelds at CES 2025

6 January 2025 at 11:45

At CES 2025 in Las Vegas, AMD unveiled a slew of new chips destined for devices ranging from desktops to gaming handhelds. AMD is riding high coming into this year’s CES. The company commanded a 28.7% share of the desktop CPU segment in Q3 2024, up 9.6 percentage points compared to the same quarter the […]

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Intel shows off its latest chip lineup at CES 2025

6 January 2025 at 06:00

Fresh off of its worst year since going public in 1971, Intel is announcing new chips at CES 2025 that it hopes will turn its fortunes around. The product announcement is Intel’s largest since the company’s board of directors forced out CEO Pat Gelsinger. That’s not the only reason stakes are high. Intel’s 13th- and […]

Β© 2024 TechCrunch. All rights reserved. For personal use only.

Before yesterdayMain stream

Using 2D materials on chips without destroying the wiring

Silicon chip manufacturers like Intel and TSMC are constantly outdoing themselves to make ever smaller features, but they are getting closer to the physical limits of silicon.

β€œWe already have very, very high density in silicon-based architectures where silicon performance degrades sharply,” said Ki Seok Kim, a scientist working at the Massachusetts Institute of Technology’s Research Laboratory of Electronics.

One way around this problem is to replace silicon with graphene-like 2D materials that maintain their semiconducting properties even at a single-atom scale. Another way is building 3D chips, which squeeze more transistors into the same area without making transistors smaller. Kim’s team did both, building a 3D chip out of vertically stacked 2D semiconductors.

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